Thermal Conductive Filler for 1.0~8.0(W/m·K) Silicone Pad
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Product Details Description The fillers is through the uniform surface coating process, the ideal surface modification of the thermal conductive composite powder is realized, which solves the problems of poor compatibility between the powder and the substrate, ensures excellent dispersion and compatibility in silicone.
1.Reasonable particle size distribution. 2.High bulk density. 3.Low oil absorption, excellent dispersion in silicone. Some product applications GD-S119A: applicable for 1.0~1.3(W/m·K) thermal conductive & flame retardant gasket. GD-S133A：applicable for 1.7~2.0 (W/m·K) thermal conductive gasket. GD-S299A：applicable for 3.0 (W/m·K) thermal conductive gasket. GD-S5201LK：applicable for 5.0(W/m·K) thermal conductive gasket with low density and low dielectric. GD-S751A：applicable for 7.0~8.0(W/m·K) thermal conductive gasket or gel. |
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