Thermal Conductive Filler for 2.0~10.0(W/m·K) Gel
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Product Details Description GD-S Series is prepared through surface modification processing of metallic oxide, has good compatibility and dispersibility in organic silicone.
1.Reasonable particle size distribution. High thermal conductivity. 2.Good dispersion, excellent processability and physicalproperties. 3.Few impurities, Non-conductiv. Some product applications GD-S228A：applicable for 2.0(W/m·K) thermal conductive gasket with low density, thermal conductive gel. GD-S351A：applicable for 4.0 (W/m·K) (one part) thermal conductive gel or thermal conductive mud with smooth and superior temperature endurance . GD-S780A：applicable for 7.8~8.0 (W/m·K) (one part) thermal conductive gel or thermal conductive mud with superior temperature endurance and low dielectric. GD-S992A：applicable for 9.0~10.0 (W/m·K) (one part) thermal conductive gel or thermal conductive mud. |
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